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 BSV 52 NPN
Switching Transistors Surface mount Si-Epitaxial PlanarTransistors Si-Epitaxial PlanarTransistoren fur die Oberflachenmontage Power dissipation - Verlustleistung
2.9 0.1 1.1
NPN
250 mW SOT-23 (TO-236) 0.01 g
0.4
3
Plastic case Kunststoffgehause
1.3 0.1
Type Code
1 2
2.5 max
Weight approx. - Gewicht ca. Plastic material has UL classification 94V-0 Gehausematerial UL94V-0 klassifiziert Standard packaging taped and reeled Standard Lieferform gegurtet auf Rolle
1.9
Dimensions / Mae in mm 1=B 2=E 3=C
Maximum ratings (TA = 25/C) Collector-Emitter-voltage Collector-Base-voltage Emitter-Base-voltage Power dissipation - Verlustleistung Collector current - Kollektorstrom (dc) Peak Collector current - Kollektor-Spitzenstrom Peak Base current - Basis-Spitzenstrom Junction temp. - Sperrschichttemperatur Storage temperature - Lagerungstemperatur B open E open C open VCE0 VCB0 VEB0 Ptot IC ICM IBM Tj TS
Grenzwerte (TA = 25/C) BSV 52 12 V 20 V 5V 250 mW 1) 100 mA 200 mA 100 mA 150/C - 65...+ 150/C
Characteristics (Tj = 25/C) Min. Collector-Base cutoff current - Kollektorreststrom IE = 0, VCB = 20 V IE = 0, VCB = 20 V, Tj = 125/C Emitter-Base cutoff current - Emitterreststrom IC = 0, VEB = 4 V IC = 10 mA, IB = 0.3 mA IC = 10 mA, IB = 1 mA IC = 50 mA, IB = 5 mA IEB0
1
Kennwerte (Tj = 25/C) Typ. - - - - - - Max. 400 nA 30 :A 100 nA 300 mV 250 mV 400 mV
ICB0 ICB0
- - - - - -
Collector saturation volt. - Kollektor-Sattigungsspg. ) VCEsat VCEsat VCEsat
1
) Mounted on P.C. board with 3 mm2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lotpad) an jedem Anschlu 01.11.2003
18
Switching Transistors Characteristics (Tj = 25/C) Min. Base saturation voltage - Basis-Sattigungsspannung 1) IC = 10 mA, IB = 1 mA IC = 50 mA, IB = 5 mA VCE = 1 V, IC = 1 mA VCE = 1 V, IC = 10 mA VCE = 1 V, IC = 50 mA Gain-Bandwidth Product - Transitfrequenz VCE = 10 V, IC = 10 mA, f = 100 MHz VCB = 5 V, IE = ie = 0, f = 1 MHz VEB = 1 V, IC = ic = 0, f = 1 MHz Switching times - Schaltzeiten turn-on time delay time rise time turn-off time storage time fall time Thermal resistance junction to ambient air Warmewiderstand Sperrschicht - umgebende Luft Marking - Stempelung ICon = 10 mA IBon = 3 mA - IBoff = 1.5 mA ton td tr toff ts tf - - - - - - RthA BSV 52 = B2 - - - - - - fT CCB0 CEB0 400 MHz - - 500 MHz - - VBEsat VBEsat hFE hFE hFE 700 mV - 25 40 25 - - - - -
BSV 52 Kennwerte (Tj = 25/C) Typ. Max. 850 mV 1.2 V - 120 - - 4 pF 4.5 pF 10 ns 4 ns 6 ns 20 ns 10 ns 10 ns 420 K/W 2)
DC current gain - Kollektor-Basis-Stromverhaltnis 1)
Collector-Base Capacitance - Kollektor-Basis-Kapazitat Emitter-Base Capacitance - Emitter-Basis-Kapazitat
) Tested with pulses tp = 300 :s, duty cycle # 2% - Gemessen mit Impulsen tp = 300 :s, Schaltverhaltnis # 2% ) Mounted on P.C. board with 3 mm2 copper pad at each terminal Montage auf Leiterplatte mit 3 mm2 Kupferbelag (Lotpad) an jedem Anschlu 01.11.2003
1 2
19


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